OMRON Corp.
OMRON announced the global launch of its new PCB inspection system VT-S10 Series, featuring imaging technology and AI to automate high-precision inspection processes for PCB sub-assemblies, eliminating the need for special operator skills. With an increased call for the new global wireless standard 5G, electric vehicles (EVs), and autonomous driving, the inspection of in-vehicle PCB assemblies becomes increasingly challenging. OMRON’s new VT-S10 solution allows for high-precision inspection to maintain and enhance quality, contributing to security and safety.
The demand for PCB assemblies for 5G, EVs, and autonomous driving has grown rapidly, raising the quality requirements of PCBs. These applications can be a risk for humans. As PCB assemblies become more dense and smaller, inspection challenges increase. Conventional PCB inspection systems struggle to take accurate images, limiting the scope and parameters of inspection. Meanwhile on the factory floor and confronted with a growing shortage of skilled workforce, employees are required to avoid close contact and movement to prevent the spread of COVID-19. The frequency of visual inspections has been reduced. Other demands are lower experience and skill requirements for the implementation of new inspection equipment, in addition to improved inspection accuracy. Where the Automotive and 5G market will became bigger, the product supply chain will be expanded. So, shape inspection such as IPC standard became more useful to maintain the inspection quality.
Equipped with OMRON's proprietary MDMC (Multi-Direction Multi-Color) imaging technology, the VT-S10 Series automatically optimizes irradiation angles, colors, and light intensity of illumination during the inspection of the PCB assembly taking characteristics such as the shapes of electronic components and soldering on the PCB into account. First tests show that this new technology can reduce the human-hours required for set up by approximately 70%. Furthermore, with the assistance of AI, this PCB inspection system can automate inspections that have until now had to rely on human senses, significantly improving inspection accuracy.
Key Features VT-S10 Series:
1. MDMC imaging technology significantly lowers chances of erroneous decisions
By utilizing its proprietary MDMC illumination, OMRON has developed an imaging technology for high-precision inspection of ever-advancing substrates and components. Through the flexible manipulation of irradiation angles, colours, and light intensity, it’s now possible to capture solder shapes more accurately than with conventional imaging methods, eliminating the interference of shadows of neighbouring tall components, and distinctly reading patterns on substrates and prints on the surface of components.
2. Minimizing programming human-hours by quantitative inspection and AI-assisted qualitative inspection
Based on the knowledge that OMRON has accumulated in both component and solder shape inspection, as well as images gained through MDMC illumination, OMRON has developed AI dedicated to solder inspection. This AI-assisted inspection is combined with quantitative inspection by MDMC to achieve reductions in both the required level of teaching skills and the chances of erroneous decisions. In a validation test with a customer, OMRON verified a reduction in visual inspection human-hours by 85
3. M2M system for production of defect-free products
Linking data with production equipment at other manufacturers utilising Omron’s proprietary QupAuto process software, allows for improved monitoring quality, minimizing defects. This new series can improve visualizing quality by developing a database of inspection results, including numerical values and images, from each process. Additionally, the VT-S10 technology enhances the first pass yield rate by automatically optimizing post-print/post-placement inspection criteria based on the inspection results at the final process. It can also link data with other production equipment manufacturers to reduce and prevent defects. A validation test with a customer showed that, with the introduction of this M2M system, the defect ratio was reduced by more than 50% by detecting and dealing with quality variations before defects occurred.