CREDIT: WOLFSPEED
Wolfspeed, Inc., developer of silicon carbide (SiC) technology, announced the commercial launch of its 200mm SiC materials products, marking a significant milestone in the company’s mission to accelerate the industry’s transition from silicon to silicon carbide. After initially offering 200mm SiC to select customers, the positive response and benefits warranted a commercial release to the market. Wolfspeed is also offering 200mm SiC epitaxy for immediate qualification, which, when paired with the company’s 200mm bare wafers, delivers breakthrough scalability and improved quality, enabling the next generation of high-performance power devices.
“Wolfspeed’s 200mm SiC wafers are more than an expansion of wafer diameter – it represents a materials innovation that empowers our customers to accelerate their device roadmaps with confidence,” says Dr. Cengiz Balkas, chief business officer. “By delivering quality at scale, Wolfspeed is enabling power electronics manufacturers to meet growing demand for higher-performing, more efficient silicon carbide solutions.”
The improved parametric specifications of the 200mm SiC bare wafers at 350µm thickness and enhanced, industry-leading doping and thickness uniformity of the 200mm epitaxy enables device makers to improve MOSFET yields, accelerate time-to-market, and deliver more competitive solutions across automotive, renewable energy, industrial, and other high-growth applications. These product and performance advancements for 200mm SiC can also be applied to Wolfspeed’s continuous learnings for 150mm SiC materials products.
“This advancement reflects Wolfspeed’s long-standing commitment to pushing the boundaries of silicon carbide materials technology,” says Balkas. “This launch demonstrates our ability to anticipate customer needs, scale with demand, and deliver the materials foundation that makes the future of more efficient power conversion possible.”